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How high performance interconnects help meet HPC/AI needs for manufacturing simulation workloads


Webinar Question: how do you increase your product development time-to-results to stay ahead of the competition?

Answer: increased acceleration in the simulation space.

That's especially true for organizations in fields such as engineering simulation, digital twins and AI/ML applications where technical computing platforms comprising High-Performance Compute (HPC) clusters, Computational Fluid Dynamics and Finite Element Analysis simulations are integral to rapid product design. And manufacturers can also harness the power of HPC for data analytics to improve existing products and services, opening up new revenue potential.

Open source simulation tools are becoming increasingly popular in application development and Cornelis Networks has released an enhanced version of its high performance Omni-Path interconnect – Cornelis Omni-Path Express - based on an industry-conformant enterprise class open source software stack.

The company is also working with partner Altair to use the open source version of Altair's industry-proven finite element analysis dynamic simulation code - Altair Radioss – to help power its Omni-Path Express accelerated host fabric adapters, edge/director class switches and gateways.

Want to hear more? Join the Register's James Hayes on 18 October 4.30pm BST/11.30am EDT/8.30am PDT as he talks with Matt Jacobs, CCO at Cornelis Networks, and Eric Lequiniou, SVP of Development at Altair. Together they will explore the importance of high performance interconnects in meeting workload requirements while ensuring efficiency and maximum productivity.

Sign up to access the webinar here and we'll send you a reminder when it's time to watch.

Sponsored by Cornelis Networks/Altair.

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